@inproceedings{3b9ad67df81d481f945559dd8d2ad4b1,
title = "High dynamic range Z-axis hybrid spring MEMS capacitive accelerometer",
abstract = "We report on a high-sensitivity, Z-axis capacitive accelerometer with high dynamic range. The high sensitivity is achieved by implementing a varying capacitive gap method, and by maintaining a narrow air gap of 2μm between the proof-mass and the stator plates. As Z-axis vertical accelerometers are very prone to stiction to the stator plates, we add a complementary set of serpentine reliability springs in order to control the displacement during high g (g=3D9.8m/s2) acceleration. It is found that using such reliability springs, there is a considerable improvement in the dynamic range, pull-in voltage, mode spacing and impact durability. The device is fabricated using an Integrated Inertial MEMS 9 DOF platform from GLOBALFOUNDRIES. Results indicate a static capacitance of 8.02pF, a pull-in voltage of 9 Volts, a sensitivity of 12 fF/g, and dynamic range of 450g.",
keywords = "Accelerometer, Impact durability, Pull-in voltage, Serpentine springs, Stiction, Torsional springs",
author = "Zakriya Mohammed and Abe, \{Ibrahim M.Elfadel\} and Mahmoud Rasras",
note = "Funding Information: This work was funded by Mubadala Development Company -Abu Dhabi, Economic Development Board-Singapore and GLOBALFOUNDRIES-Singapore under the framework of 'Twinlab' project with participation of A*STAR Institute of Microelectronics-Singapore(IME), Masdar Institute of Science and Technology-Abu Dhabi and GLOBALFOUNDRIES-Singapore. Publisher Copyright: {\textcopyright} 2018 IEEE.; 20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 ; Conference date: 22-05-2018 Through 25-05-2018",
year = "2018",
month = jun,
day = "22",
doi = "10.1109/DTIP.2018.8394219",
language = "British English",
series = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--4",
editor = "Romolo Marcelli and Yoshio Mita and Stewart Smith and Francis Pressecq and Pascal Nouet and Frederick Mailly and Peter Schneider",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018",
address = "United States",
}