@inproceedings{28f5ed76b26b4b5792f059d4c6dd5c15,
title = "High Density RRAM Arrays with Improved Thermal and Signal Integrity",
abstract = "This paper investigates new solutions for improving the performance of high density Resistive Random-Access Memories (RRAM), based on novel architecture and on the use of alternative materials. Starting from the conventional architecture, which integrates in a crossbar structure many elementary cells composed by one diode and one RRAM (1D1R), here an alternative reverse (1D1R-1R1D) architecture is proposed. This solution doubles the number of cells in a fixed volume and makes more efficient the bias management. An accurate electrothermal modeling is here carried out to check the obtained performance in terms of signal and thermal integrity. The use of the proposed architecture, along with a suitable choice of materials, including novel carbon nanomaterials, can solve or at least mitigate the electrical and thermal crosstalk problems, which are known to be critical for the RRAM crossbar configurations. A case-study is carried out, where a 3×3×4 crossbar structure is analyzed by means of a full 3D electrothermal model.",
keywords = "Carbon nanotubes, electrothermal models, high density integration, RRAM, signal integrity, thermal crosstalk",
author = "K. Lahbacha and H. Belgacem and W. Dghais and F. Zayer and Antonio Maffucci",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 25th IEEE Workshop on Signal and Power Integrity, SPI 2021 ; Conference date: 10-05-2021 Through 12-05-2021",
year = "2021",
month = may,
day = "10",
doi = "10.1109/SPI52361.2021.9505230",
language = "British English",
series = "SPI 2021 - 25th IEEE Workshop on Signal and Power Integrity",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "SPI 2021 - 25th IEEE Workshop on Signal and Power Integrity",
address = "United States",
}