Abstract
An account is given on a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). The goal of the program is to educate skilled engineers, technical managers, and visionary leaders who can pull off the transition to the future for the electronics packaging industry. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses.
| Original language | British English |
|---|---|
| Pages (from-to) | 907-911 |
| Number of pages | 5 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| State | Published - 1999 |
| Event | Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA Duration: 1 Jun 1999 → 4 Jun 1999 |