Extending the limits of air-cooling in microelectronic equipment

Peter Rodgers; Valérie Eveloy; Michael G. Pecht

doi:10.1109/ESIME.2005.1502891

Extending the limits of air-cooling in microelectronic equipment

Peter Rodgers, Valérie Eveloy, Michael G. Pecht

Mechanical & Nuclear Engineering

University of Maryland

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

13 Scopus citations

Abstract

Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

Original language	British English
Title of host publication	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Pages	695-702
Number of pages	8
DOIs	https://doi.org/10.1109/ESIME.2005.1502891
State	Published - 2005
Event	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 - Berlin, Germany Duration: 18 Apr 2005 → 20 Apr 2005

Publication series

Name	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Volume	2005

Conference

Conference	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Country/Territory	Germany
City	Berlin
Period	18/04/05 → 20/04/05

Access to Document

10.1109/ESIME.2005.1502891

Cite this

Rodgers, P., Eveloy, V., & Pecht, M. G. (2005). Extending the limits of air-cooling in microelectronic equipment. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 (pp. 695-702). Article 1502891 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; Vol. 2005). https://doi.org/10.1109/ESIME.2005.1502891

Rodgers, Peter ; Eveloy, Valérie ; Pecht, Michael G. / Extending the limits of air-cooling in microelectronic equipment. Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. 2005. pp. 695-702 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005).

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title = "Extending the limits of air-cooling in microelectronic equipment",

abstract = "Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.",

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booktitle = "Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005",

note = "6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 ; Conference date: 18-04-2005 Through 20-04-2005",

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Rodgers, P, Eveloy, V & Pecht, MG 2005, Extending the limits of air-cooling in microelectronic equipment. in Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005., 1502891, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, vol. 2005, pp. 695-702, 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, Berlin, Germany, 18/04/05. https://doi.org/10.1109/ESIME.2005.1502891

Extending the limits of air-cooling in microelectronic equipment. / Rodgers, Peter; Eveloy, Valérie; Pecht, Michael G.
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. 2005. p. 695-702 1502891 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Rodgers P, Eveloy V, Pecht MG. Extending the limits of air-cooling in microelectronic equipment. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. 2005. p. 695-702. 1502891. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005). doi: 10.1109/ESIME.2005.1502891

Extending the limits of air-cooling in microelectronic equipment

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