TY - GEN
T1 - Experimental characterization of thermally enhanced polymer composite heat exchangers
AU - Rodgers, Peter
AU - Diana, Antoine
AU - Bojanampati, Shrinivas
AU - Dewinter, Sean
AU - Krishna, Vishal
AU - Gulati, Pulkit
AU - Eveloy, Valerie
AU - Elsayed, Loutfi
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/4/30
Y1 - 2015/4/30
N2 - The latest developments in thermally enhanced polymer composite materials have opened opportunities in the design and fabrication of novel effective heat exchangers, having excellent heat transfer characteristics, chemical resistance, and both lower weight and cost compared with metallic materials. In this study, a thermally enhanced polyphenylene sulfide (PPS) polymer parallel plate cross-flow air-water heat exchanger prototype is manufactured by injection molding and experimentally characterized. The polymeric exchanger thermofluid performance is found to be comparable to that of a conventional aluminum exchanger having the same geometry, demonstrating its potential for air-liquid cooling of electronic equipment.
AB - The latest developments in thermally enhanced polymer composite materials have opened opportunities in the design and fabrication of novel effective heat exchangers, having excellent heat transfer characteristics, chemical resistance, and both lower weight and cost compared with metallic materials. In this study, a thermally enhanced polyphenylene sulfide (PPS) polymer parallel plate cross-flow air-water heat exchanger prototype is manufactured by injection molding and experimentally characterized. The polymeric exchanger thermofluid performance is found to be comparable to that of a conventional aluminum exchanger having the same geometry, demonstrating its potential for air-liquid cooling of electronic equipment.
UR - https://www.scopus.com/pages/publications/84945193628
U2 - 10.1109/SEMI-THERM.2015.7100162
DO - 10.1109/SEMI-THERM.2015.7100162
M3 - Conference contribution
AN - SCOPUS:84945193628
T3 - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
SP - 208
EP - 215
BT - 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015
Y2 - 15 March 2015 through 19 March 2015
ER -