Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

John Lohan; Pekka Tiilikka; Peter Rodgers; Carl Magnus Fager; Jukka Rantala

doi:10.1109/6144.868861

Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

John Lohan, Pekka Tiilikka, Peter Rodgers, Carl Magnus Fager, Jukka Rantala

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

Abstract

The steady state thermal performance of an isolated SO-8 package is experimentally characterized on five thermal test printed circuit boards (PCBs) and the results compared against corresponding numerical predictions. The study includes the low and high conductivity JEDEC standard, FR4 test PCBs and typical application boards. With each PCB displaying a different internal structure and effective thermal conductivity, this study highlights the sensitivity of component operating temperature to the PCB, provides benchmark data for validating PCB numerical modeling methodologies, and helps one assess the applicability of standard junction-to-ambient thermal resistance (θ_JA) data for design purposes on nonstandard PCBs. Measurements of junction temperature and component-PCB surface temperature distributions were used to identify the most appropriate modeling methodology for both the component and the PCB. Based on these results, a new PCB modeling methodology is proposed that conserves the need for modeling detail without compromising prediction accuracy.

Original language	British English
Pages (from-to)	578-586
Number of pages	9
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	23
Issue number	3
DOIs	https://doi.org/10.1109/6144.868861
State	Published - Sep 2000

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10.1109/6144.868861

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title = "Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection",

abstract = "The steady state thermal performance of an isolated SO-8 package is experimentally characterized on five thermal test printed circuit boards (PCBs) and the results compared against corresponding numerical predictions. The study includes the low and high conductivity JEDEC standard, FR4 test PCBs and typical application boards. With each PCB displaying a different internal structure and effective thermal conductivity, this study highlights the sensitivity of component operating temperature to the PCB, provides benchmark data for validating PCB numerical modeling methodologies, and helps one assess the applicability of standard junction-to-ambient thermal resistance (θJA) data for design purposes on nonstandard PCBs. Measurements of junction temperature and component-PCB surface temperature distributions were used to identify the most appropriate modeling methodology for both the component and the PCB. Based on these results, a new PCB modeling methodology is proposed that conserves the need for modeling detail without compromising prediction accuracy.",

author = "John Lohan and Pekka Tiilikka and Peter Rodgers and Fager, {Carl Magnus} and Jukka Rantala",

note = "Funding Information: Manuscript received October 6, 1999; revised February 29, 2000. This work was presented at the Fifth International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Rome, Italy, October 3-6, 1999. This work was supported in part by Nokia. This work was recommended for publication by Associate Editor B. Courtois upon evaluation of the reviewers{\textquoteright} comments.",

year = "2000",

month = sep,

doi = "10.1109/6144.868861",

language = "British English",

volume = "23",

pages = "578--586",

journal = "IEEE Transactions on Components and Packaging Technologies",

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Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection. / Lohan, John; Tiilikka, Pekka; Rodgers, Peter et al.
In: IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, 09.2000, p. 578-586.

Research output: Contribution to journal › Article › peer-review

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N1 - Funding Information: Manuscript received October 6, 1999; revised February 29, 2000. This work was presented at the Fifth International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Rome, Italy, October 3-6, 1999. This work was supported in part by Nokia. This work was recommended for publication by Associate Editor B. Courtois upon evaluation of the reviewers’ comments.

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Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

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