Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications

Man Lung Sham, Jang Kyo Kim

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.10.1115/1.1849232

Original languageBritish English
Pages (from-to)47-51
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume127
Issue number1
DOIs
StatePublished - Mar 2005

Keywords

  • Bi-Material Strip Bending (BMSB)
  • Finite Element Method
  • Residual Stress
  • Underfill Resins

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