Abstract
In this paper, an analytical solution is presented for a shaft-loaded blister test for a thin film-substrate system. Both bending and stretching modes of deformation of the film are considered in the model. It is suggested that film-substrate delamination behavior under a Mode I separation load is governed by a parameter that relates the membrane stress to the rigidity of the film. The delamination behavior of several model thin film-substrate systems under repeated mechanical loads is studied. It is suggested from the results that film-substrate delamination under cyclic load depends on film rigidity, loading frequency, and film-substrate interfacial characteristics.
| Original language | British English |
|---|---|
| Pages (from-to) | 15-20 |
| Number of pages | 6 |
| Journal | Journal of Composites Technology and Research |
| Volume | 23 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2001 |
Keywords
- Blister test
- Deformation
- Film-substrate system