Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid

J. Garg, B. Poudel, M. Chiesa, J. B. Gordon, J. J. Ma, J. B. Wang, Z. F. Ren, Y. T. Kang, H. Ohtani, J. Nanda, G. H. McKinley, G. Chen

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