Abstract
The electronic packaging strategies that are being planned in Hong Kong and surrounding region are presented. The International Symposium on Electronic Materials and Packaging (EMAP 2003) was held in Singapore with an objective to create an international forum for the exchange of recent developments in electronic packaging and assembly. It is the only conference series in the subject area that rotate its venue around Asian countries. It organizes discussions on state-of-art technologies and the recent developments in the electronic fields.
| Original language | British English |
|---|---|
| Title of host publication | Advancing Microelectronics |
| Pages | 27 |
| Number of pages | 1 |
| Volume | 31 |
| Edition | 1 |
| State | Published - Jan 2004 |