Electroless copper plating of tungsten powders and preparation of WCu20 composites by microwave sintering

Langlang Wang, Lei Xu, C. Srinivasakannan, Sivasankar Koppala, Zhaohui Han, Hongying Xia

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

Abstract

In the present work, tungsten powders coated with copper by electroless plating method, and preparation of WCu20 composites by microwave sintering with copper-coated tungsten powder as raw material. The result shows that at the situation of a temperature of 60 °C, pH value of 12–13, with formaldehyde solution (53 ml/L) as reducing agent, iron potassium cyanide solution (0.3 g/L) as stabilizer, tartaric acid potassium sodium (15 g/L) and EDTA-2Na (19 g/L) mixture solution as compound complexing agent, the thickness of surface coating was relatively uniform, which is around 0.6–1.1 μm. The WCu20 composites were fabricated by microwave sintering with copper-coated tungsten powder as raw material shows uniform microstructure distribution, relatively high density. The hardness of the WCu20 composites increased with the temperature. While the temperature of sintering at 1100 °C for 1 h, the density could be up to 15.22 g/cm3, relative density was 97.13%, which shows better properties.

Original languageBritish English
Pages (from-to)177-185
Number of pages9
JournalJournal of Alloys and Compounds
Volume764
DOIs
StatePublished - 5 Oct 2018

Keywords

  • Copper-coated tungsten powders
  • Electroless copper plating
  • Microstructure
  • Microwave sintering
  • Tungsten-copper composites

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