@inproceedings{f4ff1bc0d7244a41a27295c340cbfd30,
title = "Electrochemical behavior of copper in post-via-etch cleaning solutions",
abstract = "The actions of glycolic acid and BTA on copper have been investigated by electrochemical methods. Different concentrations in glycolic acid were investigated: 1%wt, 2%wt, 3%wt and 4%wt. Results show that the cleaning action of glycolic acid results from smooth corrosion of the metal. Copper dissolution increases with glycolic acid concentration due to the formation of a copper complex which precedes copper dissolution. In the presence of BTA, a corrosion inhibitor of copper, a [Cu(I)BTA] complex is formed on the surface which blocks copper dissolution. In a mixture of glycolic acid and BTA (l%wt/ 0.1%wt), an intermediary behavior is observed. A competitive action occurs between the film formation due to the interaction between BTA and copper and the superficial etching of the metal by glycolic acid which removes the inhibitor-copper film.",
author = "S. Bilouk and C. Pernel and Nogueira, {R. P.} and L. Broussous and Haumesser, {P. H.} and G. Passemard",
year = "2007",
doi = "10.1149/1.2779403",
language = "British English",
isbn = "9781566775687",
series = "ECS Transactions",
number = "2",
pages = "395--402",
booktitle = "ECS Transactions - 10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing",
edition = "2",
note = "10th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 212th ECS Meeting ; Conference date: 07-10-2007 Through 12-10-2007",
}