TY - JOUR
T1 - Electrical Tomography Hardware Systems for Real-Time Applications
T2 - a Review
AU - Tiwari, Varun Kumar
AU - Meribout, Mahmoud
AU - Khezzar, Lyes
AU - Alhammadi, Khalid
AU - Tarek, Mohamed
N1 - Publisher Copyright:
© 2013 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper presents a review of two-dimensional (2D) and three-dimensional (3D) electrical tomography (ET) hardware accelerators for real-time applications. While many recent review papers have discussed various algorithms for image reconstruction or acquisition systems, none of them has considered state-of-the-art hardware implementations of the associated image reconstruction algorithms to achieve real-time performance, especially for 3D ET where the computation requirement is excessively high. A 3D ET is useful in various applications such as robotics, autonomous vehicles, and process control, but it is computationally very expensive with respect to its 2D counterpart. Most implementations are based on single or multi-core CPUs and, to a lesser extent, on either graphics processing units (GPUs) or field programmable gate arrays (FPGAs). However, there is a clear gap between the currently available processors, whose computation power exceeds hundreds of teraflops per second (TOPS) at a reasonable low power consumption, and the ones recently used in ET systems. This gives great potential for next-generation ET systems to achieve real-time 2D and 3D ET reconstruction within a small form factor. The paper summarizes the most recent ET hardware systems with respect to their performance in terms of quality and processing frame rate, reconstruction methods, along with optimization and future directions.
AB - This paper presents a review of two-dimensional (2D) and three-dimensional (3D) electrical tomography (ET) hardware accelerators for real-time applications. While many recent review papers have discussed various algorithms for image reconstruction or acquisition systems, none of them has considered state-of-the-art hardware implementations of the associated image reconstruction algorithms to achieve real-time performance, especially for 3D ET where the computation requirement is excessively high. A 3D ET is useful in various applications such as robotics, autonomous vehicles, and process control, but it is computationally very expensive with respect to its 2D counterpart. Most implementations are based on single or multi-core CPUs and, to a lesser extent, on either graphics processing units (GPUs) or field programmable gate arrays (FPGAs). However, there is a clear gap between the currently available processors, whose computation power exceeds hundreds of teraflops per second (TOPS) at a reasonable low power consumption, and the ones recently used in ET systems. This gives great potential for next-generation ET systems to achieve real-time 2D and 3D ET reconstruction within a small form factor. The paper summarizes the most recent ET hardware systems with respect to their performance in terms of quality and processing frame rate, reconstruction methods, along with optimization and future directions.
KW - electrical capacitance tomography
KW - Electrical impedance tomography
KW - image reconstruction
KW - parallel computing platforms
KW - sensor design
UR - http://www.scopus.com/inward/record.url?scp=85137593181&partnerID=8YFLogxK
U2 - 10.1109/ACCESS.2022.3203584
DO - 10.1109/ACCESS.2022.3203584
M3 - Review article
AN - SCOPUS:85137593181
SN - 2169-3536
VL - 10
SP - 93933
EP - 93950
JO - IEEE Access
JF - IEEE Access
ER -