Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding
- Yu Hin Chan
- , Jang Kyo Kim
- , Deming Liu
- , Peter Chou Kee Liu
- , Yiu Ming Cheung
- , Ming Wai Ng
- The Hong Kong University of Science and Technology
- ASM Assembly Automation Ltd.
Research output: Contribution to journal › Article › peer-review
23
Scopus
citations