Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Yu Hin Chan; Jang Kyo Kim; Deming Liu; Peter Chou Kee Liu; Yiu Ming Cheung; Ming Wai Ng

doi:10.1109/TADVP.2005.853548

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Yu Hin Chan
, Jang Kyo Kim
, Deming Liu
, Peter Chou Kee Liu
, Yiu Ming Cheung
, Ming Wai Ng

Mechanical & Nuclear Engineering

The Hong Kong University of Science and Technology
ASM Assembly Automation Ltd.

Research output: Contribution to journal › Article › peer-review

23 Scopus citations

Abstract

The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma-cleaned bond pads are exposed to air to evaluate the recontamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning.

Original language	British English
Pages (from-to)	674-684
Number of pages	11
Journal	IEEE Transactions on Advanced Packaging
Volume	28
Issue number	4
DOIs	https://doi.org/10.1109/TADVP.2005.853548
State	Published - Nov 2005

Keywords

Au wire bond
Au-Ni-Cu bond pad
Plasma treatment
Process window
Surface energy

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title = "Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding",

abstract = "The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma-cleaned bond pads are exposed to air to evaluate the recontamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning.",

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author = "Chan, \{Yu Hin\} and Kim, \{Jang Kyo\} and Deming Liu and Liu, \{Peter Chou Kee\} and Cheung, \{Yiu Ming\} and Ng, \{Ming Wai\}",

note = "Funding Information: The authors would like to thank the Innovation and Technology Commission (ITC), Hong Kong SAR Government, for the continuous support of this project through the Innovation and Technology Fund (UIT/32). They would also like to thank the Materials Characterization and Preparation Facilities (MCPF) and EPack Laboratory at HKUST for assistance with experiments. Funding Information: Manuscript received May 2, 2003; revised March 10, 2004. This work was supported in part by the Innovation and Technology Commission (ITC), the Hong Kong SAR Government, ASM Assembly Automation Ltd., and the Universal Printed Circuit Company. Ltd. Part of this paper was presented at the International Symposium on Electronic Materials and Packaging (EMAP) 2002, Kaohsiung, Taiwan, December 2002.",

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N2 - The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma-cleaned bond pads are exposed to air to evaluate the recontamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning.

AB - The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma-cleaned bond pads are exposed to air to evaluate the recontamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning.

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Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

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