@inproceedings{76edfeebd4954ea38cac80efef0bf829,
title = "Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin",
abstract = "A study is made of the effects of black copper oxide coating and other plating variables on adhesion strength of glob-top resin to copper substrates for Tape Ball Grid Array (TBGA) package applications. The button shear test was performed to measure the interfacial bonding strength. Several surface analytical techniques were employed to establish the correlations between the interface bond strength and various surface parameters, such as surface free energy, chemical element, surface roughness and fracture morphology. The experimental results showed that the presence of black oxide coating (Sample C) resulted in significantly higher interface bond strength than the bare copper (Sample A) or nickel coated (Sample B) surfaces. Further processes (Samples D and E) after the black oxide coating exhibited detrimental effects, to a varying degree, on interface bond strength. The interface bond strength was approximately proportional both to surface free energy and roughness of surface finishes, indicating that wettability and mechanical interlocking both played a significant role in forming adhesion with glob top resins.",
keywords = "Adhesives, Bonding, Coatings, Copper, Resins, Rough surfaces, Surface cracks, Surface finishing, Surface morphology, Surface roughness",
author = "M. Lebbai and Kim, {J. K.} and Yuen, {M. M.F.} and P. Tong",
note = "Publisher Copyright: {\textcopyright} 2000 IEEE.; 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing ; Conference date: 18-06-2000 Through 21-06-2000",
year = "2000",
doi = "10.1109/ADHES.2000.860575",
language = "British English",
series = "4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "61--69",
editor = "Marika Hyytiainen",
booktitle = "4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000",
address = "United States",
}