Abstract
The application of shaft-loaded blister method to study the durability of the film-substrate interface under repeated mechanical loadings was examined. Both quasi-static and cyclic tests were carried out in an Instron Tester using a 50 N load cell. To characterize the propagation of delamination under cyclic loading, a range of displacement levels were chosen around which delamination had initiated under monotonic quasi-static loading. Results confirmed that the shaft-loaded blister test is an effective and efficient method to evaluate the durability of the film-substrate interface.
| Original language | British English |
|---|---|
| Pages (from-to) | 57-59 |
| Number of pages | 3 |
| Journal | Journal of Materials Science Letters |
| Volume | 19 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2000 |