Delamination behavior of film-substrate systems under cyclic loading

The application of shaft-loaded blister method to study the durability of the film-substrate interface under repeated mechanical loadings was examined. Both quasi-static and cyclic tests were carried out in an Instron Tester using a 50 N load cell. To characterize the propagation of delamination under cyclic loading, a range of displacement levels were chosen around which delamination had initiated under monotonic quasi-static loading. Results confirmed that the shaft-loaded blister test is an effective and efficient method to evaluate the durability of the film-substrate interface.