Corrected squeezed-film damping simulation validated with a lorentz-force magnetometer operating in vacuum

Alexandre Sinding, Ilker E. Ocak, Wajih U. Syed, Aveek N. Chatterjee, Christopher Welham, Shuangqin Liu, Jun Yan, Stephen Breit, Hyun Kee Chang, Ibrahim Abe M. Elfadel, Zouhair Sbiaa

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A number of corrections to the well-known squeezed-film gas damping model are required to get accurate results for MEMS. This paper reports on the implementation and validation of a corrected squeezed-film damping (SFD) simulation for common MEMS structures, electrostatic comb fingers, under various vacuum levels. Experimental Q factors were measured for the first in-plane resonant mode of a Lorentz-force magnetometer. An acoustic boundary condition was implemented to accommodate, in different areas of the sensor, various ratios a/h of squeezing surface characteristic dimension a to squeezed gas gap h. At a typical operating pressure for this sensor, e.g. 10Pa, corresponding to Knudsen number Kn ∼ 670, the simulated Q factor is within +/-25% of the measured value. This new, corrected simulation approach provides, for the first time, a practical and accurate way of predicting Q factors for complex capacitive MEMS sensors such as accelerometers, gyroscopes and magnetometers that operate at low pressure.

Original languageBritish English
Title of host publication2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages889-892
Number of pages4
ISBN (Electronic)9781509050789
DOIs
StatePublished - 23 Feb 2017
Event30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
Duration: 22 Jan 201726 Jan 2017

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Country/TerritoryUnited States
CityLas Vegas
Period22/01/1726/01/17

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