Converter-level FEM simulation for lifetime prediction of an LED driver with improved thermal modelling

H. Niu; H. Wang; X. Ye; S. Wang; F. Blaabjerg

doi:10.1016/j.microrel.2017.06.079

Converter-level FEM simulation for lifetime prediction of an LED driver with improved thermal modelling

H. Niu, H. Wang, X. Ye, S. Wang, F. Blaabjerg

Research output: Contribution to journal › Article › peer-review

13 Scopus citations

Abstract

Light-emitting diode (LED) drivers are widely regarded as the weakest link in the solid-state lighting systems. This paper proposes an improved thermal modelling process for the mission profile based lifetime prediction of reliability critical components in a LED driver for the outdoor lighting application. A converter-level finite element simulation (FEM) simulation is carried out to obtain the ambient temperature of electrolytic capacitors and power MOSFETs used in the LED driver, which takes into account the impact of the driver enclosure and the thermal coupling among different components. Therefore, the proposed method bridges the link between the global ambient temperature profile outside of the enclosure and the local ambient temperature profiles of the components of interest inside the driver. A quantitative comparison of the estimated annual lifetime consumptions of MOSFETs and capacitors are given based on the proposed thermal modelling process, and the datasheet thermal impedance models and the global ambient temperature.

Original language	British English
Pages (from-to)	117-122
Number of pages	6
Journal	Microelectronics Reliability
Volume	76-77
DOIs	https://doi.org/10.1016/j.microrel.2017.06.079
State	Published - Sep 2017

Keywords

FEM simulation
LED driver
Lifetime prediction
Mission profile

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10.1016/j.microrel.2017.06.079

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title = "Converter-level FEM simulation for lifetime prediction of an LED driver with improved thermal modelling",

abstract = "Light-emitting diode (LED) drivers are widely regarded as the weakest link in the solid-state lighting systems. This paper proposes an improved thermal modelling process for the mission profile based lifetime prediction of reliability critical components in a LED driver for the outdoor lighting application. A converter-level finite element simulation (FEM) simulation is carried out to obtain the ambient temperature of electrolytic capacitors and power MOSFETs used in the LED driver, which takes into account the impact of the driver enclosure and the thermal coupling among different components. Therefore, the proposed method bridges the link between the global ambient temperature profile outside of the enclosure and the local ambient temperature profiles of the components of interest inside the driver. A quantitative comparison of the estimated annual lifetime consumptions of MOSFETs and capacitors are given based on the proposed thermal modelling process, and the datasheet thermal impedance models and the global ambient temperature.",

keywords = "FEM simulation, LED driver, Lifetime prediction, Mission profile",

author = "H. Niu and H. Wang and X. Ye and S. Wang and F. Blaabjerg",

note = "Funding Information: The authors acknowledge the support from Natural Science Foundation of China (Grant No. 61671172), the Center of Reliable Power Electronics (CORPE), Aalborg University, Denmark and the Chinese Scholarship Council (CSC) (201606120147). Publisher Copyright: {\textcopyright} 2017 Elsevier Ltd",

year = "2017",

month = sep,

doi = "10.1016/j.microrel.2017.06.079",

language = "British English",

volume = "76-77",

pages = "117--122",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd",

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T1 - Converter-level FEM simulation for lifetime prediction of an LED driver with improved thermal modelling

AU - Niu, H.

AU - Wang, H.

AU - Ye, X.

AU - Wang, S.

AU - Blaabjerg, F.

N1 - Funding Information: The authors acknowledge the support from Natural Science Foundation of China (Grant No. 61671172), the Center of Reliable Power Electronics (CORPE), Aalborg University, Denmark and the Chinese Scholarship Council (CSC) (201606120147). Publisher Copyright: © 2017 Elsevier Ltd

PY - 2017/9

Y1 - 2017/9

N2 - Light-emitting diode (LED) drivers are widely regarded as the weakest link in the solid-state lighting systems. This paper proposes an improved thermal modelling process for the mission profile based lifetime prediction of reliability critical components in a LED driver for the outdoor lighting application. A converter-level finite element simulation (FEM) simulation is carried out to obtain the ambient temperature of electrolytic capacitors and power MOSFETs used in the LED driver, which takes into account the impact of the driver enclosure and the thermal coupling among different components. Therefore, the proposed method bridges the link between the global ambient temperature profile outside of the enclosure and the local ambient temperature profiles of the components of interest inside the driver. A quantitative comparison of the estimated annual lifetime consumptions of MOSFETs and capacitors are given based on the proposed thermal modelling process, and the datasheet thermal impedance models and the global ambient temperature.

AB - Light-emitting diode (LED) drivers are widely regarded as the weakest link in the solid-state lighting systems. This paper proposes an improved thermal modelling process for the mission profile based lifetime prediction of reliability critical components in a LED driver for the outdoor lighting application. A converter-level finite element simulation (FEM) simulation is carried out to obtain the ambient temperature of electrolytic capacitors and power MOSFETs used in the LED driver, which takes into account the impact of the driver enclosure and the thermal coupling among different components. Therefore, the proposed method bridges the link between the global ambient temperature profile outside of the enclosure and the local ambient temperature profiles of the components of interest inside the driver. A quantitative comparison of the estimated annual lifetime consumptions of MOSFETs and capacitors are given based on the proposed thermal modelling process, and the datasheet thermal impedance models and the global ambient temperature.

KW - FEM simulation

KW - LED driver

KW - Lifetime prediction

KW - Mission profile

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U2 - 10.1016/j.microrel.2017.06.079

DO - 10.1016/j.microrel.2017.06.079

M3 - Article

AN - SCOPUS:85025066552

SN - 0026-2714

VL - 76-77

SP - 117

EP - 122

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -

Converter-level FEM simulation for lifetime prediction of an LED driver with improved thermal modelling

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Keywords

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