TY - GEN
T1 - Comprehensive evaluation on efficiency and thermal loading of associated Si and SiC based PV inverter applications
AU - Sintamarean, C.
AU - Blaabjerg, F.
AU - Wang, H.
PY - 2013
Y1 - 2013
N2 - This paper deals with the design, control, efficiency and thermal cycling estimation of associated Si and SiC based three-phase PV-inverters. A novel Electro-Thermal Model able to consider the thermal coupling within the Transistor and Diode integrated on the same package is proposed. For each topology, three different cases study are simulated, according to the heatsink repartition: one-leg heatsink, shared heatsink and individual heatsink. Based on the model, it has been determined the minimum required heatsink thermal impedance in order not to overpass the device physically thermal limitations. Finally, simulation results are analyzed in order to decide which topology has a higher efficiency and a better thermal loading distribution within the devices.
AB - This paper deals with the design, control, efficiency and thermal cycling estimation of associated Si and SiC based three-phase PV-inverters. A novel Electro-Thermal Model able to consider the thermal coupling within the Transistor and Diode integrated on the same package is proposed. For each topology, three different cases study are simulated, according to the heatsink repartition: one-leg heatsink, shared heatsink and individual heatsink. Based on the model, it has been determined the minimum required heatsink thermal impedance in order not to overpass the device physically thermal limitations. Finally, simulation results are analyzed in order to decide which topology has a higher efficiency and a better thermal loading distribution within the devices.
KW - Efficiency
KW - PV-inverter
KW - thermal loading distribution
UR - http://www.scopus.com/inward/record.url?scp=84893583545&partnerID=8YFLogxK
U2 - 10.1109/IECON.2013.6699195
DO - 10.1109/IECON.2013.6699195
M3 - Conference contribution
AN - SCOPUS:84893583545
SN - 9781479902248
T3 - IECON Proceedings (Industrial Electronics Conference)
SP - 555
EP - 560
BT - Proceedings, IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society
T2 - 39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013
Y2 - 10 November 2013 through 14 November 2013
ER -