Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

V. Eveloy, P. Rodgers, J. Lohan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Numerical predictive accuracy is investigated for transient component heat transfer using a computational fluid dynamics (CFD) code dedicated to the thermal analysis of electronic equipment. The test cases are based on a single printed circuit board (PCB)-mounted, 160-lead PQFP component, analyzed in still-air, and both 1 and 2.25 m/s forced airflows. Three types of transient operating conditions are considered, namely (i) component dynamic power dissipation in fixed ambient conditions, (ii) passive component operation in dynamic ambient conditions, and (iii) combined component dynamic power dissipation in varying ambient conditions. Benchmark criteria are based on component junction temperature and component-PCB surface temperature, measured using thermal test dies and infrared thermography respectively. Using both nominal component/PCB geometry dimensions and material properties, component junction temperature is found to be accurately predicted for component dynamic power dissipation, in both fixed and varying ambient air temperature conditions.

Original languageBritish English
Title of host publicationITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
EditorsBahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
PublisherIEEE Computer Society
Pages36-45
Number of pages10
ISBN (Electronic)0780371526
DOIs
StatePublished - 2002
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: 30 May 20021 Jun 2002

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2002-January
ISSN (Print)1936-3958

Conference

Conference8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/TerritoryUnited States
CitySan Diego
Period30/05/021/06/02

Keywords

  • Accuracy
  • Circuit testing
  • Computational fluid dynamics
  • Electronic components
  • Electronic equipment
  • Heat transfer
  • Power dissipation
  • Printed circuits
  • Temperature measurement
  • Transient analysis

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