Comparison and validation of experimental techniques to measure electronic component operating junction temperature

J. Lohan, P. Rodgers, C. M. Fager, R. Lehtiniemi, V. Eveloy, P. Tiilikka, J. Rantala

Research output: Contribution to conferencePaperpeer-review

3 Scopus citations

Abstract

Increasing power densities and changing component design have brought about the need for accurate measurement of die junction temperature. While many different techniques exist it is difficult to compare their relative performance. To validate the accuracy of various direct and indirect test methods, the operating junction temperature of board-mounted SO16 and PQFP160 devices has been recorded using standard thermal test die. Numerical analysis was also used to predict junction temperature and package temperature gradients. The performance of each technique is evaluated for accuracy, ease of use and relevance to real applications.

Original languageBritish English
Pages233-238
Number of pages6
StatePublished - 1998
EventProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures - Cannes, Fr
Duration: 27 Sep 199829 Sep 1998

Conference

ConferenceProceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures
CityCannes, Fr
Period27/09/9829/09/98

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