Characterization of thermal conductivity in polymer composite heat exchanger parts

Ismail Darawsheh, Antoine Diana, Peter Rodgers, Valerie Eveloy, Fahad Almaskari

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Fiber-reinforced, injection-molded polymer composite materials can provide heat exchanger heat transfer rates comparable to those of metallic materials. However, the relationship between fiber orientation and thermal conductivity, and its effects on the heat transfer rate need to be investigated. In this study, a methodology to determine the anisotropic thermal conductivity of an injection-molded commercially-available, thermally-enhanced polymer composite, based on numerical simulation combined with experimentation is presented. The injection molding process is numerically modeled to predict fiber orientation. The filler characteristics of injection-molded polymer composite parts are experimentally determined to derive the composite material thermal conductivity distribution using Nielsen semi-empirical model. This methodology is applied to a heat exchanger unit air channel geometry, that is virtually manufactured using either injection molding or a combination of injection molding and machining. The numerically predicted thermal conductivity values range from approximately 14 W/m.K to 16 W/m.K, depending on geometric location and manufacturing process. These values are underpredicted by up to 18% compared with laser flash measurements on physical prototypes manufactured using a combination of injection molding and machining, and are lower than the vendor-reported effective thermal conductivity (i.e., 19-21 W/m.K).

Original languageBritish English
Title of host publication2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509043446
DOIs
StatePublished - 10 May 2017
Event18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 - Dresden, Germany
Duration: 3 Apr 20175 Apr 2017

Publication series

Name2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

Conference

Conference18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
Country/TerritoryGermany
CityDresden
Period3/04/175/04/17

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