Abstract
This paper proposes a system called CDID for diagnosing semiconductor fabrication process. CDID can identify the carry-over defect type that contributed to a defective cluster captured by an in-line inspection tool during a specific fabrication processing step. Let Rx be a defective cluster captured by an in-line inspection tool during the fabrication processing step psi. First, CDID would identify the defect type of Rx by comparing the image of Rx with the images in reference wafer maps of previous defect clusters captured at psi. Let dj be the identified defect type. CDID would use rules of inferences for identifying the root cause of dj CDID would utilize dj as a trigger for the appropriate defect specification rules using the standard rules of inferences. Based on established and well-known causes of defects, CDID composes rule-based defect specifications in the form of propositional logic's premises. The premises are triggered by applying the inference rules. By applying the defect specification rules recursively using the inference rules, CDID can identify the root cause of dj The quality of CDID has been experimentally evaluated by measuring its prediction accuracy. Results revealed marked prediction accuracy.
| Original language | British English |
|---|---|
| Pages (from-to) | 221-231 |
| Number of pages | 11 |
| Journal | IEEE Transactions on Semiconductor Manufacturing |
| Volume | 31 |
| Issue number | 2 |
| DOIs | |
| State | Published - May 2018 |
Keywords
- defect type
- processing step
- root cause of defect
- Semiconductor wafer fabrication
- wafer defect
- wafer map