@inproceedings{a6c5cb9a5ca84809947328d2983fa2fa,
title = "Carbon nanomaterials based TSVs for dual sensing and vertical interconnect application",
abstract = "We discuss fabrication and characterization of TSVs filled with carbon nano-materials (CNM) for dual function of sensing and vertical interconnect for hostile environment applications (Corrosive High Temperature and Pressure). Nano-composites, made by functionalization of CNTs were integrated using dispersion in epoxy resin and inkjet techniques to fill up the TSVs and provide sensing surface. The results reveal ability for the nano-composite to fill vias with electrical conductivity path and sensing established through the wafer backside.",
keywords = "Carbon, Carbon nanotubes, Chemical sensors, Filling, Sensors, Through-silicon vias",
author = "Sofela, \{Samuel O.\} and Hammad Younes and Madina Jelbuldina and Irfan Saadat and Ghaferi, \{Amal Al\}",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 ; Conference date: 18-05-2015 Through 21-05-2015",
year = "2015",
month = nov,
day = "10",
doi = "10.1109/IITC-MAM.2015.7325669",
language = "British English",
series = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "289--291",
booktitle = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",
address = "United States",
}