Carbon nanomaterials based TSVs for dual sensing and vertical interconnect application

Samuel O. Sofela, Hammad Younes, Madina Jelbuldina, Irfan Saadat, Amal Al Ghaferi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

We discuss fabrication and characterization of TSVs filled with carbon nano-materials (CNM) for dual function of sensing and vertical interconnect for hostile environment applications (Corrosive High Temperature and Pressure). Nano-composites, made by functionalization of CNTs were integrated using dispersion in epoxy resin and inkjet techniques to fill up the TSVs and provide sensing surface. The results reveal ability for the nano-composite to fill vias with electrical conductivity path and sensing established through the wafer backside.

Original languageBritish English
Title of host publication2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages289-291
Number of pages3
ISBN (Electronic)9781467373562
DOIs
StatePublished - 10 Nov 2015
EventIEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 - Grenoble, France
Duration: 18 May 201521 May 2015

Publication series

Name2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

Conference

ConferenceIEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
Country/TerritoryFrance
CityGrenoble
Period18/05/1521/05/15

Keywords

  • Carbon
  • Carbon nanotubes
  • Chemical sensors
  • Filling
  • Sensors
  • Through-silicon vias

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