Candidate thermally enhanced polymer composite materials for cooling of electronic systems

Peter Rodgers, Valerie Eveloy, Loutfi El Sayed

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Driven by the low density, corrosion resistance, manufacturability, and low raw material and manufacturing costs of polymer composites materials, considerable attention is currently being devoted to the innovation, characterization, and implementation of such materials. In this this study the thermal and mechanical properties, and injection moldability of a broad range thermally-enhanced, commercially-available polymeric composite materials are reviewed to help identify candidate materials that could replace conventional metal alloys in electronic cooling heat sink and heat exchanger applications. The material property characterization data reviewed essentially consists of vendor data generated in accordance with applicable characterization standards. From twenty five commercially-available polymeric composite materials, two promising candidate groups of materials, namely polyphenylene sulfide (PPS) and polyimide 66 (PA66), are identified.

Original languageBritish English
Title of host publicationTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479954155
DOIs
StatePublished - 2 Dec 2014
Event20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014 - Greenwich, London, United Kingdom
Duration: 24 Sep 201426 Sep 2014

Publication series

NameTHERMINIC 2014 - 20th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

Conference

Conference20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014
Country/TerritoryUnited Kingdom
CityGreenwich, London
Period24/09/1426/09/14

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