TY - JOUR
T1 - Atomic layer deposition of transition metal films and nanostructures for electronic and catalytic applications
AU - Maina, James W.
AU - Merenda, Andrea
AU - Weber, Matthieu
AU - Pringle, Jennifer M.
AU - Bechelany, Mikhael
AU - Hyde, Lachlan
AU - Dumée, Ludovic F.
N1 - Funding Information:
Dr. Maina would like to thank Deakin University for his Alfred Deakin Research Fellowship. Dr. Dumée acknowledges the Australian Research Council for his Discovery Early Career Research Award (DECRA).
Publisher Copyright:
© 2020 Taylor & Francis Group, LLC.
PY - 2021
Y1 - 2021
N2 - Atomic layer deposition (ALD) has emerged as the technique of choice in the microelectronics industry, owing to its self-limiting nature, that allows conformal film deposition in highly confined spaces. However, while the ALD of metal oxide has developed dramatically over the past decade, ALD of pure metal, particularly the transition metals has been developing at a very slow pace. This article reviews the latest development in the ALD of pure transition metals and alloys, for electronic and catalytic applications. In particular, the article analyzes how different factors, such as the substrate properties, deposition conditions, precursor and co-reactant properties, influence the deposition of the metal films and nanostructures, as well as the emerging applications of the ALD derived transition metal nanostructures. The challenges facing the field are highlighted, and suggestions are made for future research directions.
AB - Atomic layer deposition (ALD) has emerged as the technique of choice in the microelectronics industry, owing to its self-limiting nature, that allows conformal film deposition in highly confined spaces. However, while the ALD of metal oxide has developed dramatically over the past decade, ALD of pure metal, particularly the transition metals has been developing at a very slow pace. This article reviews the latest development in the ALD of pure transition metals and alloys, for electronic and catalytic applications. In particular, the article analyzes how different factors, such as the substrate properties, deposition conditions, precursor and co-reactant properties, influence the deposition of the metal films and nanostructures, as well as the emerging applications of the ALD derived transition metal nanostructures. The challenges facing the field are highlighted, and suggestions are made for future research directions.
KW - Atomic layer deposition (ALD)
KW - catalytic applications
KW - electronic applications
KW - nanostructures
KW - transition metals
UR - http://www.scopus.com/inward/record.url?scp=85091142744&partnerID=8YFLogxK
U2 - 10.1080/10408436.2020.1819200
DO - 10.1080/10408436.2020.1819200
M3 - Review article
AN - SCOPUS:85091142744
SN - 1040-8436
VL - 46
SP - 468
EP - 489
JO - Critical Reviews in Solid State and Materials Sciences
JF - Critical Reviews in Solid State and Materials Sciences
IS - 5
ER -