ASIC Implementation of Associative Memory and Hamming Distance for HDC Application

Eman Hassan, Huruy Tesfai, Baker Mohammad, Hani Saleh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Brain-inspired Hyperdimensional computing (HDC) emulates the human brain in the way of memorization, association, and reasoning. At its essence, HDC is about comparing and manipulating vectors of large sizes, making it a good candidate for the realm of AI. In the classification task, associative memory (AM) is responsible for finding the best match between classes hypervectors and query hypervector using Hamming distance (HM) approach. This paper proposes a digital design for the hyperdimensional associative memory (HDAM) main functionality. The DHAM architectures search for the nearest HM and can be scaled linearly to any vector dimension. The design space is explored for 2-options, namely sequential (SDHAM), optimized for the low area but has high latency, and parallel one (PDHAM), optimized for low latency but incur high area. Proven industry-standard ASIC design flow with 65nm foundry technology is used to realize both design and report the power, performance, and area (PPA) results. Our experimental results show that the SDHAM implementation enhances the area and energy by 1.6x and 4.023x compared to the PDHAM design at the latency cost of O(n_{classes}-1). In addition, our results improve the area and energy-delay by 4.6x and 5.6x compared to the state-of-art reports.

Original languageBritish English
Title of host publication2021 28th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2021 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728182810
DOIs
StatePublished - 2021
Event28th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2021 - Dubai, United Arab Emirates
Duration: 28 Nov 20211 Dec 2021

Publication series

Name2021 28th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2021 - Proceedings

Conference

Conference28th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2021
Country/TerritoryUnited Arab Emirates
CityDubai
Period28/11/211/12/21

Keywords

  • Application Specific Integrated Circuit (ASIC)
  • Associative Memory
  • Complementary Metal Oxide Semiconductor (CMOS)
  • Content Addressable memory (CAM)
  • Encoding
  • Hyperdimensional Computing
  • Similarity

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