TY - GEN
T1 - Analysis of squeeze film air damping in MEMS with lattice Boltzmann method
AU - Yang, Weilin
AU - Li, Hongxia
AU - Zhang, Tiejun
AU - Chatterjee, Aveek N.
AU - Elfadel, Ibrahim M.
N1 - Funding Information:
This work was funded by the Mubadala Development Company-Abu Dhabi, Economic Development Board-Singapore and GLOBALFOUNDRIES-Singapore under the framework of 'TwinLab' project with participation of ASTAR Institute of Microelectronics-Singapore, Masdar Institute of Science and Technology-Abu Dhabi and GLOBALFOUNDRIES-Singapore.
Publisher Copyright:
© 2016 IEEE.
PY - 2016/7/20
Y1 - 2016/7/20
N2 - Squeeze film air damping has significant impact on the performance of microelectromechanical devices. In order to understand the squeezed-film damping mechanism, Reynolds equation and its derivatives have been used in previous studies. In fact, the Reynolds equation has limitations in quantifying MEMS characteristics because its assumptions on small amplitude and non-slip boundary condition may not be satisfied in practice. Advanced modeling approaches should be considered to capture detailed energy dissipation physics. In this paper, we study the squeeze film air damping in MEMS using lattice Boltzmann method, which is derived from classical Boltzmann transport equation. Our major focus is to reveal how the air film is squeezed by the side movement of a comb structure. By considering the slippage and amplitude effect, direct lattice Boltzmann simulations are performed to obtain the Q factor. Viscous damping and elastic damping, two contributors to the energy loss, are quantitatively compared to reveal the dominant damping mechanism.
AB - Squeeze film air damping has significant impact on the performance of microelectromechanical devices. In order to understand the squeezed-film damping mechanism, Reynolds equation and its derivatives have been used in previous studies. In fact, the Reynolds equation has limitations in quantifying MEMS characteristics because its assumptions on small amplitude and non-slip boundary condition may not be satisfied in practice. Advanced modeling approaches should be considered to capture detailed energy dissipation physics. In this paper, we study the squeeze film air damping in MEMS using lattice Boltzmann method, which is derived from classical Boltzmann transport equation. Our major focus is to reveal how the air film is squeezed by the side movement of a comb structure. By considering the slippage and amplitude effect, direct lattice Boltzmann simulations are performed to obtain the Q factor. Viscous damping and elastic damping, two contributors to the energy loss, are quantitatively compared to reveal the dominant damping mechanism.
KW - CFD
KW - Lattice Boltzmann method
KW - Quality factor
KW - Squeezed film damping
UR - https://www.scopus.com/pages/publications/84983340029
U2 - 10.1109/ITHERM.2016.7517593
DO - 10.1109/ITHERM.2016.7517593
M3 - Conference contribution
AN - SCOPUS:84983340029
T3 - Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
SP - 530
EP - 535
BT - Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
Y2 - 31 May 2016 through 3 June 2016
ER -