Analysis of squeeze film air damping in MEMS with lattice Boltzmann method

Weilin Yang, Hongxia Li, Tiejun Zhang, Aveek N. Chatterjee, Ibrahim M. Elfadel

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Squeeze film air damping has significant impact on the performance of microelectromechanical devices. In order to understand the squeezed-film damping mechanism, Reynolds equation and its derivatives have been used in previous studies. In fact, the Reynolds equation has limitations in quantifying MEMS characteristics because its assumptions on small amplitude and non-slip boundary condition may not be satisfied in practice. Advanced modeling approaches should be considered to capture detailed energy dissipation physics. In this paper, we study the squeeze film air damping in MEMS using lattice Boltzmann method, which is derived from classical Boltzmann transport equation. Our major focus is to reveal how the air film is squeezed by the side movement of a comb structure. By considering the slippage and amplitude effect, direct lattice Boltzmann simulations are performed to obtain the Q factor. Viscous damping and elastic damping, two contributors to the energy loss, are quantitatively compared to reveal the dominant damping mechanism.

Original languageBritish English
Title of host publicationProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages530-535
Number of pages6
ISBN (Electronic)9781467381215
DOIs
StatePublished - 20 Jul 2016
Event15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States
Duration: 31 May 20163 Jun 2016

Publication series

NameProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016

Conference

Conference15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
Country/TerritoryUnited States
CityLas Vegas
Period31/05/163/06/16

Keywords

  • CFD
  • Lattice Boltzmann method
  • Quality factor
  • Squeezed film damping

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