An On-Line Calibration Method for TSEP-Based Junction Temperature Estimation

Yingzhou Peng, Qian Wang, Haoran Wang, Huai Wang

    Research output: Contribution to journalArticlepeer-review

    16 Scopus citations

    Abstract

    Temperature sensitive electrical parameters (TSEP) provide an indirect and noninvasive method for on-line junction temperature estimation of power semiconductor devices. It is known that the fundamental of TSEP-based methods is to calibrate the relationship between TSEP and junction temperature in advance. However, the calibration methods in the literature need to open the module, require pretesting, or record the operating data of a converter in the entire power rating range, which are inconvenient in field applications. This article proposes an on-line and noninvasive calibration method by measuring the data at three operating states that are already existed in the regular converter operation. It is achieved by measuring the accessible heatsink/case temperature and TSEP during converter regular operation. The concept, implementation, and error analysis of the proposed method are presented in this article. Experimental verification is given to prove the effectiveness, accuracy, and convenience of the proposed method.

    Original languageBritish English
    Pages (from-to)13616-13624
    Number of pages9
    JournalIEEE Transactions on Industrial Electronics
    Volume69
    Issue number12
    DOIs
    StatePublished - 1 Dec 2022

    Keywords

    • Condition monitoring
    • junction temperature
    • power converter
    • power semiconductor

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