@inproceedings{3a4ac1446ad14193b5de652a653a4b4f,
title = "An Icepak-PSpice co-simulation method to study the impact of bond wires fatigue on the current and temperature distribution of IGBT modules under short-circuit",
abstract = "Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.",
author = "Rui Wu and Francesco Iannuzzo and Huai Wang and Frede Blaabjerg",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.",
year = "2014",
month = nov,
day = "11",
doi = "10.1109/ECCE.2014.6954155",
language = "British English",
series = "2014 IEEE Energy Conversion Congress and Exposition, ECCE 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "5502--5509",
booktitle = "2014 IEEE Energy Conversion Congress and Exposition, ECCE 2014",
address = "United States",
}