TY - GEN
T1 - An experimental assessment of computational fluid dynamics predictive accuracy for electronic component operational temperature
AU - Eveloy, Valérie
AU - Rodgers, Peter
AU - Hashmi, M. S.J.
PY - 2003
Y1 - 2003
N2 - The flow modeling approaches employed in Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated Printed Circuit Boards. This limitation has been previously highlighted [1], with component junction temperature prediction errors of up to 35% reported. This study evaluates the predictive capability of candidate turbulence models more suited to the analysis of electronic component heat transfer. Significant improvements in component junction temperature prediction accuracy are obtained, relative to a standard high-Reynolds number k-e model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.
AB - The flow modeling approaches employed in Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated Printed Circuit Boards. This limitation has been previously highlighted [1], with component junction temperature prediction errors of up to 35% reported. This study evaluates the predictive capability of candidate turbulence models more suited to the analysis of electronic component heat transfer. Significant improvements in component junction temperature prediction accuracy are obtained, relative to a standard high-Reynolds number k-e model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.
UR - http://www.scopus.com/inward/record.url?scp=1842640234&partnerID=8YFLogxK
U2 - 10.1115/ht2003-47282
DO - 10.1115/ht2003-47282
M3 - Conference contribution
AN - SCOPUS:1842640234
SN - 0791836959
SN - 9780791836958
T3 - Proceedings of the ASME Summer Heat Transfer Conference
SP - 477
EP - 487
BT - Proceedings of the 2003 ASME Summer Heat Transfer Conference, Volume 3
T2 - 2003 ASME Summer Heat Transfer Conference (HT2003)
Y2 - 21 July 2003 through 23 July 2003
ER -