TY - JOUR
T1 - A thermal modeling method considering ambient temperature dynamics
AU - Wang, Haoran
AU - Zhu, Rongwu
AU - Wang, Huai
AU - Liserre, Marco
AU - Blaabjerg, Frede
N1 - Funding Information:
Manuscript received April 23, 2019; revised May 24, 2019 and June 17, 2019; accepted June 20, 2019. Date of publication June 23, 2019; date of current version October 18, 2019. This work was supported in part by the Innovation Fund Denmark through the Advanced Power Electronic Technology and Tools Project and in part by the European Research Council under the European Union’s Seventh Framework Program under Grant 616344 HEART—the Highly Efficient And Reliable Smart Transformer. (Corresponding author: Rongwu Zhu.) H. Wang, H. Wang, and F. Blaabjerg are with the Department of Energy Technology, Aalborg University 9220, Aalborg Denmark (e-mail: [email protected]; [email protected]; [email protected]).
Publisher Copyright:
© 1986-2012 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which cannot be achieved by existing analytical methods. By using the superposition theorem and time-domain analysis, the limitations of the existing analytical method based on stable ambient temperature are investigated. Then, the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.
AB - This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which cannot be achieved by existing analytical methods. By using the superposition theorem and time-domain analysis, the limitations of the existing analytical method based on stable ambient temperature are investigated. Then, the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.
KW - Ambient temperature
KW - mission profile
KW - power electronic components
KW - thermal dynamics
KW - thermal model
UR - http://www.scopus.com/inward/record.url?scp=85074188460&partnerID=8YFLogxK
U2 - 10.1109/TPEL.2019.2924723
DO - 10.1109/TPEL.2019.2924723
M3 - Article
AN - SCOPUS:85074188460
SN - 0885-8993
VL - 35
SP - 6
EP - 9
JO - IEEE Transactions on Power Electronics
JF - IEEE Transactions on Power Electronics
IS - 1
M1 - 8744620
ER -