A thermal modeling method considering ambient temperature dynamics

Haoran Wang, Rongwu Zhu, Huai Wang, Marco Liserre, Frede Blaabjerg

    Research output: Contribution to journalArticlepeer-review

    27 Scopus citations


    This letter proposes a thermal modeling method for power electronic components. It represents the thermal dynamics introduced by the ambient temperature variation, which cannot be achieved by existing analytical methods. By using the superposition theorem and time-domain analysis, the limitations of the existing analytical method based on stable ambient temperature are investigated. Then, the proposed thermal modeling method, which considers the thermal dynamics from both power loss and ambient temperature disturbances, is presented. In order to obtain the thermal coefficients in the proposed model, two solutions are provided based on frequency-domain modeling. Experimental verification is given to proof the accuracy of the proposed thermal modeling method considering the ambient temperature dynamics.

    Original languageBritish English
    Article number8744620
    Pages (from-to)6-9
    Number of pages4
    JournalIEEE Transactions on Power Electronics
    Issue number1
    StatePublished - Jan 2020


    • Ambient temperature
    • mission profile
    • power electronic components
    • thermal dynamics
    • thermal model


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