TY - GEN
T1 - A survey of thermal energy harvesting techniques and interface circuitry
AU - Alhawari, Mohammad
AU - Mohammad, Baker
AU - Saleh, Hani
AU - Ismail, Mohammed
PY - 2013
Y1 - 2013
N2 - Emerging technology in semiconductor devices and circuits has enabled ultra-low power systems in medical, structural (bridges), and hard to reach places which fueled the energy scavenging research and its interface circuitry. The energy can be harvested from ambient sources such as vibration, wireless, thermal and solar. To harvest the energy, special interface circuit needs to be designed for suitable energy conversion such as DC-DC converters, power management unit, and storage elements. In this paper, we present a survey about the state-of-the-art thermal energy harvesting systems focusing on the interface circuitry, and explaining the tradeoffs in human body-based harvesting applications.
AB - Emerging technology in semiconductor devices and circuits has enabled ultra-low power systems in medical, structural (bridges), and hard to reach places which fueled the energy scavenging research and its interface circuitry. The energy can be harvested from ambient sources such as vibration, wireless, thermal and solar. To harvest the energy, special interface circuit needs to be designed for suitable energy conversion such as DC-DC converters, power management unit, and storage elements. In this paper, we present a survey about the state-of-the-art thermal energy harvesting systems focusing on the interface circuitry, and explaining the tradeoffs in human body-based harvesting applications.
UR - http://www.scopus.com/inward/record.url?scp=84901450982&partnerID=8YFLogxK
U2 - 10.1109/ICECS.2013.6815434
DO - 10.1109/ICECS.2013.6815434
M3 - Conference contribution
AN - SCOPUS:84901450982
SN - 9781479924523
T3 - Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems
SP - 381
EP - 384
BT - 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems, ICECS 2013
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2013 IEEE 20th International Conference on Electronics, Circuits, and Systems, ICECS 2013
Y2 - 8 December 2013 through 11 December 2013
ER -