A shaft-loaded blister test for elastic response and delamination behavior of thin film-substrate system

Xiaojing Xu, Christopher Shearwood, Kin Liao

Research output: Contribution to journalConference articlepeer-review

18 Scopus citations

Abstract

The elastic response of a thin film of photoresist deposited on a silicon wafer is studied by using a shaft-loaded blister test method developed recently. Experiment data are compared with an analytical solution. Results demonstrated that under shaft loading, the thin film underwent a pure bending mode at small deformation and gradually transformed to a pure stretching mode at larger deformation. The effect of residual stress on elastic response is also studied. The delamination of thin film from substrate can be successfully measured under displacement control mode by the shaft-loaded blister test.

Original languageBritish English
Pages (from-to)115-119
Number of pages5
JournalThin Solid Films
Volume424
Issue number1
DOIs
StatePublished - 22 Jan 2003
Eventproceedings of the 1st Ineternational Conference on Materials - Singapore, Singapore
Duration: 1 Jul 20016 Jul 2001

Keywords

  • Delamination
  • Mechanics of thin film
  • Shaft-loaded blister test
  • Thin film

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