A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators

Z. X. Wang, H. Wang, Y. Zhang, F. Blaabjerg

    Research output: Contribution to journalArticlepeer-review

    6 Scopus citations

    Abstract

    This paper investigates two compact thermal model representations for multi-chip power modules, namely the thermal impedance matrix model and the thermal admittance matrix model. The latter can shape a multi-port thermal network without controlled temperature sources, and can be readily implemented in circuit simulators. The mutual transformation between the two models and their relationship to parameters in the multi-port network are revealed. In addition, practical tips for thermal model parameter extractions based on temperature measurements and curve-fitting are discussed. The multi-port thermal model is verified by simulations and experimental results. It confirms that more accurate temperature estimation can be achieved compared with the thermal model without the thermal coupling effect.

    Original languageBritish English
    Pages (from-to)519-523
    Number of pages5
    JournalMicroelectronics Reliability
    Volume88-90
    DOIs
    StatePublished - Sep 2018

    Keywords

    • Multi-chip power module
    • Thermal model

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