A minimum viable mission profile emulator for IGBT modules in modular multilevel converters

Zhongxu Wang, Huai Wang, Yi Zhang, Frede Blaabjerg

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Abstract

    Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

    Original languageBritish English
    Title of host publication34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages313-318
    Number of pages6
    ISBN (Electronic)9781538683309
    DOIs
    StatePublished - 24 May 2019
    Event34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States
    Duration: 17 Mar 201921 Mar 2019

    Publication series

    NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
    Volume2019-March

    Conference

    Conference34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
    Country/TerritoryUnited States
    CityAnaheim
    Period17/03/1921/03/19

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