TY - BOOK
T1 - 3D stacked chips
T2 - From emerging processes to heterogeneous systems
AU - Elfadel, Ibrahim Abe M.
AU - Fettweis, Gerhard
N1 - Publisher Copyright:
© Springer International Publishing Switzerland 2016.
PY - 2016/1/1
Y1 - 2016/1/1
N2 - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
AB - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
UR - https://www.scopus.com/pages/publications/85012123652
U2 - 10.1007/978-3-319-20481-9
DO - 10.1007/978-3-319-20481-9
M3 - Book
AN - SCOPUS:85012123652
SN - 9783319204802
BT - 3D stacked chips
ER -