3D stacked chips: From emerging processes to heterogeneous systems

Ibrahim Abe M. Elfadel, Gerhard Fettweis

Research output: Book/ReportBookpeer-review

4 Scopus citations

Abstract

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Original languageBritish English
Number of pages339
ISBN (Electronic)9783319204819
DOIs
StatePublished - 1 Jan 2016

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