@inproceedings{97b9f82b1f4b4cb58afc8084020dcbb1,
title = "3D Si-level integration in wireless sensor node",
author = "{Van Engen}, Piet and {Van Doremalen}, Ric and Wouter Jochems and Ad Rommers and Shi Cheng and Anders Rydberg and Thomas Fritzsch and J{\"u}rgen Wolf and {De Raedt}, Walter and Philippe M{\"u}ller and Eduardo Alarcon and Mihai Sanduleanu",
note = "Funding Information: The support from the European Commission in the Research Project e-CUBES, contract number IST-026461, is gratefully acknowledged. Furthermore, the co-operation and fruitful discussions with all the e-CUBES partners have been very valuable. Also the contribution of Texas Instruments, who supplied the necessary MSP430 micro-Processor wafers, has been essential for the development of the demonstrator.; Smart Systems Integration Conference 2009, SSI 2009 ; Conference date: 10-03-2009 Through 11-03-2009",
year = "2009",
language = "British English",
series = "Smart Systems Integration 2009, SSI 2009",
pages = "150--157",
booktitle = "Smart Systems Integration 2009, SSI 2009",
}