Equipments Details
Description
The Karl Suss Mask Aligner performs high resolution photolithography. It offers unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness, as well as standard size wafers up to 6’’ in diameter. It uses 5” masks System and it can be operated manually. All contact exposure programs (vacuum, hard, soft contact and proximity) are provided to print structures far into the submicron region.
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