Reactive Ion Etcher Fl-

    Equipment/facility: Equipment

    • LocationShow on map

      Masdar Institute, 1A, Undercroft, Micro/Nanofabrication Facility, Bay 2

    Equipments Details


    The RIE-200iP Fluorine RIE is a load lock type high precision plasma reactive ion etching system that can be used to etch all types of semiconducting, insulating and dielectric films. It includes all the features of the open-load platform but adds a surface treated protective shield that is raised during substrate loading. The shield protects the condition of the slit valve seal, and also improves uniformity. The SAMCO Fluorine system uses several different gasses as the source for F ions which are active on silicon and dielectrics. Photoresist can be used to mask but for improved selectivity, deeper etch runs can be made using Oxide or Nitride masks. Metals are not allowed in this tool.


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