Oxygen Plasma Etcher

    Equipment/facility: Equipment

    Equipments Details


    Oxygen plasma etcher is used for the precise and controlled removal of material from the surface of samples. In many applications, they serve to clean or modify surfaces to make them more suitable for subsequent processing or analysis.The machine generates a plasma using a gas (in this case, oxygen) under low pressure and applies it to the sample's surface. The excited oxygen species in the plasma react with the sample material, either removing it (in the case of organic materials) or oxidizing it (in the case of certain metals). Applications: -Cleaning: Removal of organic residues from sample surfaces. -Surface Activation: Modifying the surface properties to enhance adhesion or wettability. -Etching: Precisely removing layers from a sample, often used in semiconductor processing. -Ashing: Converting organic compounds into their ashed (or oxidized) form for analysis.


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