MicroTest Wirebonder

    Equipment/facility: Equipment

    • LocationShow on map

      Masdar Institute, 1A, Undercroft, Micro/Nanofabrication Facility, Bay 1

    Equipments Details

    Description

    WB-100 is a manual/ semiautomatic thermosonic wire bonder for Wedge bonding, Ball bonding and Ball Bumping. This bonder was designed to make 0.5 to 2.0 mil gold or aluminium wire.