Lesker PVD 75 Thermal Evaporator

The Kurt J. Lesker PVD 75 Thermal Evaporator is equipped for thermal evaporation. We typically use the evaporator to deposit metals and semiconductor materials. Evaporation provides directionality in depositions which is beneficial when doing liftoff metallization (as opposed to conformal coating with sputtering deposition). The Thermal evaporator is limited in terms of temperature of evaporation, so materials that melt at high temperatures (Ti) are easier to evaporate in the E-beam Evaporator. Users are in charge of procuring their own materials for the depositions process. Crystal oscillators are used to monitor deposition rates and thickness. The chamber has the capacity to process three 100 mm wafers or a single 150, 200, or 300 mm wafer. The vacuum consists of a scroll pump and a Turbo pump.