DRIE Silicon/Silicon Nitride

The Plasma Lab 100 DRIE system is a load locked, inductively coupled plasma (ICP) etcher is a multipurpose fluorocarbon based system that provides users anisotropic etching of silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature controlled electrode to help users tailor their etch feature profiles. The manual load system can accommodate substrates ranging from 150mm diameter wafers down to small pieces. Process Gasses Available: SF6, C4F8, O2