Dicing Saw

Wafer dicing is the process by which die are separated from a wafer following the processing of the wafer. During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted