Atomic Layer Deposition

The FlexAL is an Atomic Layer Deposition (ALD) system which can provide a new range of flexibility and capability in the engineering of nanoscale structures and devices. FlexAL ALD offers both remote plasma atomic layer deposition (ALD) processes and thermal ALD. The ALD system offers maximum flexibility in the choice of materials and precursors, Low-temperature processes enabled by plasma ALD, Low damage maintained by the use of remote plasma, Controllable, repeatable processes via recipe-driven software interface. Key Features: Remote plasma & thermal ALD in one flexible tool, Automated 200mm load lock for process flexibility, Up to 6 Bubbled liquid precursors, Ozone generator and MFC controlled gas lines with rapid delivery for thermal gas precursors (e.g. NH3, O2) and plasma gases (e.g. O2, N2, H2)